EP1SGX25F672C7N vs EP1SGX25CF672C7N Comparación
Comparación detallada lado a lado de EP1SGX25F672C7N por Intel y EP1SGX25CF672C7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25F672C7N | EP1SGX25CF672C7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $338,50 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Embedded Memory (bits) | 1,944,576 | — |
| Number of I/O Banks | 4 | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pins] | — |
| Number of Registers | 25,660 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | 3.125 Gbps | Up to 3.1875 Gbps |
| Operating Supply Voltage (Core) | 1.5 V nominal | — |
| Rango de temperatura de funcionamiento | 0°C to 85°C (commercial) | — |
| Process Technology | CMOS | — |
| Encapsulado | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch | 672-ball FC-FBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant (lead-free FBGA) | — |
| Logic Array Blocks (LABs) | — | 2566 |
| User I/O Pins | — | 455 |
| Embedded Memory Bits | — | 1944576 |
| High-Speed Transceiver Channels | — | Up to 20 |
| Core Voltage | — | 1.5 V |
| Temperatura de funcionamiento | — | 0 C to 85 C (Commercial) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | SRAM (volatile, requires external flash) |
| Lead-Free / RoHS | — | RoHS3 Compliant |
| Logic Family / Process | — | CMOS, 1.5 V core |