EP1SGX25CF672C7N - 25K LE Stratix GX FPGA 672-FBGA | Altera
N.º de pieza: EP1SGX25CF672C7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $485.92 | $485,92 |
| 10 | $432.5 | $4.325,00 |
| 100 | $398.2 | $39.820,00 |
| 500 | $365 | $182.500,00 |
| 1.000 | $338.5 | $338.500,00 |
EP1SGX25CF672C7N Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory interfaces, and DSP blocks. Stratix GX devices are positioned in the FPGA hierarchy as high-speed-transceiver-equipped parts - that is, FPGA -> SRAM-based programmable logic -> transceiver-enabled FPGA -> Stratix GX family. The GX suffix denotes integrated multi-gigabit transceivers (MGTs) with embedded CDR (clock data recovery) and SERDES, distinguishing the family from general-purpose Stratix devices. The EP1SGX25CF672C7N sits in the mid-density tier of the original Stratix GX lineup, bridging cost-sensitive designs that still need multi-gigabit serial links.
Key features of the EP1SGX25CF672C7N include up to 20 transceiver channels organized in groups of four, on-chip phase-locked loops (PLLs) for clock synthesis and jitter cleanup, dedicated Double Data Rate (DDR) memory interfaces, and TriMatrix embedded memory blocks that can be configured as RAM, ROM, or FIFO. The transceiver blocks support multiple industry-standard protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet when paired with the appropriate soft logic and PHY IP. The 1 mm-pitch FC-FBGA package enables high-density board routing while remaining compatible with conventional multilayer PCB fabrication processes.
The internal architecture pairs a fine-grained logic fabric with column- and row-based I/O structures, giving designers predictable timing closure and high utilization rates. Configuration is volatile SRAM, requiring a configuration device (typically an EPCS or EPCQ serial flash) to load the bitstream at power-up. The design entry flow is supported by the Altera Quartus II development environment, with mature IP catalogs for transceiver and memory controller instantiation. Per the original Stratix GX family data sheet, the part is fabricated in a 1.5 V CMOS process with copper interconnect, with the device core divided into multiple voltage islands for the logic fabric, transceivers, and I/O.
Typical applications include 10 Gbps line card interfaces for telecommunications switches, serial RapidIO and PCI Express endpoint bridging in storage and embedded computing, high-speed serial backplane aggregation in router and switch fabrics, protocol converter ASIC/FPGA replacement designs, and test equipment requiring flexible multi-protocol serial I/O. The 455 available user I/Os also support parallel LVDS interfaces and high-speed external memory buses, which combined with the on-chip memory make the device well suited for buffer and queue management in networking line cards.
A primary design consideration when using the EP1SGX25CF672C7N is the transceiver reference clock and power architecture: each MGT quad requires a clean, low-jitter reference clock and dedicated analog supply rails (1.5 V, 2.5 V) that must be heavily decoupled. PCB layout must follow the Stratix GX transceiver design guidelines for controlled-impedance differential traces, AC-coupling capacitors, and guard ground vias to achieve the rated 3.1875 Gbps bit-error-rate performance. Designers should also budget configuration flash storage and consider dual-boot or remote update paths for in-field firmware revision management.
This page synthesizes distributor stock, current pricing, and a same-family drop-in alternatives matrix not found in the original manufacturer datasheet, giving component engineers and procurement specialists a single reference for sourcing and substitution decisions.
Alternativas directas para EP1SGX25CF672C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX25CF672C7N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, RoHS Status, Process Technology, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX25CF672C7
✅ Sustitución directa✓ En stock
$340 / unidad
Ver hoja de datos →EP1SGX25CF672C6N
✅ Sustitución directa✓ En stock
$210 / unidad
Ver hoja de datos →EP1SGX25CF672C6
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1SGX25CF672C5
✅ Sustitución directa✓ En stock
$1304.99 / unidad
Ver hoja de datos →EP1SGX25-CF672-I6
✅ Sustitución directa✓ En stock
$168 / unidad
Ver hoja de datos →EP1SGX10CF672C7N
✅ Sustitución directa✓ En stock
$182.1 / unidad
Ver hoja de datos →EP1SGX25CF672C7N Valores máximos y características eléctricas
| Family | Stratix GX |
| Logic Elements | 25660 |
| Logic Array Blocks (LABs) | 2566 |
| User I/O Pins | 455 |
| Embedded Memory Bits | 1944576 |
| High-Speed Transceiver Channels | Up to 20 |
| Transceiver Data Rate | Up to 3.1875 Gbps |
| Core Voltage | 1.5 V |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) |
| Encapsulado | 672-ball FC-FBGA |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Configuration Method | SRAM (volatile, requires external flash) |
| Lead-Free / RoHS | RoHS3 Compliant |
| Logic Family / Process | CMOS, 1.5 V core |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EP1SGX25CF672C7N 33 x 33 mm
Configuración de pines para EP1SGX25CF672C7N (encapsulado 33 x 33 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1SGX25CF672C7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1SGX25CF672C7N es adecuado para 6 aplicacións: 10 Gbps Telecom Line Card Interface, Serial RapidIO Bridge in Embedded Computing, Backplane Aggregation in Switch Fabric, Protocol Converter ASIC/FPGA Replacement, Test and Measurement Equipment Front End, PCI Express Endpoint and Switch.
10 Gbps Telecom Line Card Interface
The EP1SGX25CF672C7N is well matched to telecom line card designs where aggregated serial I/O bandwidth exceeds the capability of lower-density FPGAs. Its 20 transceiver channels at up to 3.1875 Gbps each support protocols such as XAUI, OC-48, and multi-channel Gigabit Ethernet when paired with the Stratix GX soft IP. The 25,660 logic elements and 1,944,576 bits of embedded memory are sufficient to implement the entire MAC, PCS layer, and ingress buffering for a multi-port line card in a single device, while the 672-ball FC-FBGA package provides 455 user I/Os for parallel backplane connections and external memory bus expansion.
Recomendado
Serial RapidIO Bridge in Embedded Computing
For embedded computing applications that aggregate Serial RapidIO (SRIO) traffic between DSPs, microprocessors, and switched fabrics, the EP1SGX25CF672C7N provides the integrated 3.1875 Gbps SERDES, CDR, and clock recovery circuitry required for both 1x and 4x SRIO link widths. The 1.5 V core and 25,660 logic elements are sufficient to implement an SRIO endpoint or switch plus a parallel RapidIO-to-PCIe or RapidIO-to-Ethernet bridge in a single device. The 672-ball FC-FBGA package footprint integrates easily with 1.5 V power distribution networks common in VME and VPX backplanes, and the 455 user I/Os allow direct connection to multiple parallel DSP host ports.
Recomendado
Backplane Aggregation in Switch Fabric
Switch fabric line cards aggregating traffic from multiple backplane lanes use the EP1SGX25CF672C7N to bridge serial backplane protocols such as Serial RapidIO, XAUI, and proprietary chip-to-chip links. The 20 transceiver channels can be partitioned into four groups of four plus a shared channel, supporting independent backplane fabrics. The 1,944,576 bits of TriMatrix embedded memory serve as packet buffers and queue managers, while the 25,660 logic elements implement the queue scheduling and traffic-management logic. The commercial 0 to 85 C operating range is suitable for centrally cooled switch chassis where board temperature is well controlled.
Recomendado
Protocol Converter ASIC/FPGA Replacement
Engineers using the EP1SGX25CF672C7N as a drop-in replacement for obsolete ASIC-based protocol converters benefit from the integrated 3.1875 Gbps transceivers that eliminate external PHY chips. The 25,660 logic elements support complex protocol stacks including PCIe, XAUI, SRIO, and custom serial protocols without the NRE of an ASIC. The volatile SRAM configuration also allows in-field firmware updates through a configuration flash, enabling single-device designs to support multiple protocol variants by simply changing the loaded bitstream - a significant advantage over fixed-function ASIC implementations.
Recomendado
Test and Measurement Equipment Front End
High-end protocol analyzers and BERT (bit error rate tester) front ends benefit from the EP1SGX25CF672C7N's 20 multi-gigabit transceivers, which can be dynamically reconfigured across multiple protocols via different bitstreams. The 455 user I/Os and 1.5 V core allow direct interface to high-speed ADCs, DACs, and parallel test data buses without external bus bridges. Per the Stratix GX datasheet, the transceiver CDR performance is well suited for pattern generation and analysis at 3.1875 Gbps, while the 25,660 logic elements can implement protocol-aware state machines for protocol-aware BER measurements.
Recomendado
PCI Express Endpoint and Switch
The EP1SGX25CF672C7N implements PCI Express x1, x4, and x8 endpoints and root complexes through its integrated transceivers, eliminating external PCIe PHY chips. The Stratix GX PCIe hard IP and soft IP support PCIe Gen 1 at 2.5 Gbps per lane, while the remaining logic elements handle the application layer, DMA engines, and memory controllers. The 672-ball FC-FBGA package allows direct connection to multiple PCIe slots and downstream bridges. The volatile SRAM configuration is useful for development systems that need to test multiple PCIe configurations, while the 1.5 V core integrates with conventional 1.5 V power distribution networks used in add-in cards and blade servers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX25CF672C7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX25CF672C7 | EP1SGX25CF672C6N | EP1SGX25CF672C6 | EP1SGX25CF672C5 | EP1SGX25-CF672-I6 | EP1SGX10CF672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Logic Elements | 25660 | 25660 (identical) | 25660 (identical) | 25660 (identical) | 25660 (identical) | 25660 (identical) | 10570 (-59%) |
| Speed Grade | C7 | C7 (identical) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | C5 (slowest, -2 grades) | I6 (industrial, -1 grade) | C7 (identical) |
| Transceiver Channels | Up to 20 | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Up to 20 (identical) | Fewer (lower density) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
Diferenciadores clave
- Highest commercial speed grade in the Stratix GX 25K family (frente a EP1SGX25CF672C6N)
- Full 20-channel transceiver capacity at mid-density logic (frente a EP1SGX10CF672C7N)
- Commercial 0 to 85 C operating range (frente a EP1SGX25-CF672-I6)
Notas de diseño
The 672-ball FC-FBGA package uses a 1.0 mm ball pitch, which requires laser-drilled micro vias or 0.8 mm drill holes in the PCB stack-up. Designers should follow the Stratix GX PCB design guidelines for breakout routing, escape pattern, and stack-up selection. Use a 6-8 layer PCB minimum with continuous ground planes adjacent to each signal layer to achieve the 3.1875 Gbps transceiver signal integrity. Vias-in-pad with filled and plated-over copper is recommended for the BGA balls to minimize stub lengths and to enable the package's full I/O density.
The EP1SGX25CF672C7N requires multiple supply rails including VCCINT (1.5 V core), VCCIO (I/O bank voltage, variable per bank), VCCA (PLL analog 1.5 V), VCCA_PLL (transceiver analog), and VCCCH (transceiver high-current). Per the Stratix GX datasheet, each transceiver quad can draw significant current during operation. Decoupling must be dense: place 0.1 uF and 0.01 uF ceramic capacitors as close as possible to every VCC and GND ball pair, and add bulk polymer or tantalum capacitors on each supply plane. A separate analog ground island connected to the main ground at a single point is required for the transceiver PLLs.
Estimated: based on a 33 x 33 mm FC-FBGA package, the EP1SGX25CF672C7N dissipates roughly 3-5 W typical in active use and up to 8-10 W with all 20 transceivers at 3.1875 Gbps. A 4-layer PCB with internal solid ground planes typically yields a theta_JA of approximately 18-22 C/W, giving a junction temperature rise of 80-110 C at 5 W - a thermal relief copper pour is required, and forced-air cooling is recommended. Configuration volatility is also a critical pitfall: the SRAM-based bitstream is lost on every power cycle, so an EPCS or EPCQ configuration flash and a reliable POR circuit are mandatory.
Each 3.1875 Gbps transceiver channel requires 100 ohm differential controlled-impedance routing (typically 85 ohm for the Stratix GX reference design), AC coupling capacitors of 100 nF on both TX and RX pairs, and short lengths from the BGA to the AC coupling caps. Per the Stratix GX transceiver design guide, ground stitching vias should be placed every lambda/10 (about 1.5-2 mm) along the differential traces. Skew between P and N within a pair must be under 5 ps, and length matching between TX and RX of a lane should be within 25 ps to maintain CDR lock.
Información de cumplimiento
RoHS3 compliant per the alterachips.com product listing. REACH, halogen-free status, and conflict minerals compliance not stated in verified web data - set to 'unknown'. AEC-Q100 not applicable to FPGAs.