EP20K400EFI672-2X vs EP20K400EFC672-1XN Comparación
Comparación detallada lado a lado de EP20K400EFI672-2X por Intel y EP20K400EFC672-1XN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400EFI672-2X | EP20K400EFC672-1XN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $168,00 | $215,00 |
| Family | APEX 20KE | APEX 20K |
| Series | EP20K400E | APEX-20KE |
| Logic Elements | 16,640 | — |
| System Gates | 400,000 | 400,000 |
| Embedded Memory | 212,992 bits | — |
| Maximum User I/O | 488 | — |
| Number of I/O Banks | 8 | [DATA_NEEDED: I/O bank count] |
| PLLs | 4 | — |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.18 µm CMOS |
| Maximum Internal Frequency | 223 MHz | [DATA_NEEDED: max internal frequency] |
| Temperatura de funcionamiento | 0 °C to 85 °C (Industrial) | — |
| Encapsulado | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm | 672-BBGA (FC-FBGA, FineLine BGA) |
| Ball Pitch | 1.27 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel de sensibilidad a la humedad (MSL) | 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Sin halógenos | Compliant | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 16,640 |
| Logic Array Blocks (LABs) | — | 1,664 |
| Total RAM Bits | — | 212,992 |
| User I/O | — | 488 |
| Supply Voltage - Core | — | 1.8 V |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Embedded PLLs | — | 4 |
| Operating Temperature Grade | — | Industrial / Other (per MPN suffix) |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG (IEEE 1149.1) |