EP20K600CF672I8 vs EP20K600CF672C8N Comparación
Comparación detallada lado a lado de EP20K600CF672I8 por Altera y EP20K600CF672C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K600CF672I8 | EP20K600CF672C8N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $108,00 |
| Family | APEX 20KC | APEX 20KC |
| Device Type | SPLD / FPGA | SPLD |
| Logic Elements / Cells | 24,320 | — |
| Macros (Logic Cells) | 2432 | — |
| Typical Gate Count | 600,000 gates | — |
| Embedded Memory | 311,296 bits | — |
| User I/Os | 488 to 508 | — |
| Número de pines | 652 (functional) / 672 (BGA balls) | — |
| Propagation Delay (typical) | 1.48 ns | — |
| Internal Frequency (max) | [DATA_NEEDED: max internal frequency in MHz] | — |
| Core Supply Voltage | 1.8 V | — |
| Process Technology | 0.15 µm all-layer copper | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (Industrial) | 0°C to 85°C |
| Package Type | 672-ball BGA, 45 x 45 mm, 1.27 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Estado RoHS | Compliant per legacy product records | unknown |
| Configuration Interface | JTAG / Passive Serial | — |
| Design Tool | Quartus II (legacy MAX+PLUS II) | — |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Encapsulado | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | — | 672-pin FC-FBGA |
| Tensión de alimentación | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Propagation Delay | — | 1.48 ns |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Resistencia térmica | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |