EP20K600CF672I8 vs EP20K600CF672C8N Comparaison
Comparaison détaillée côte à côte de EP20K600CF672I8 par Altera et EP20K600CF672C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K600CF672I8 | EP20K600CF672C8N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $195,00 | $108,00 |
| Family | APEX 20KC | APEX 20KC |
| Device Type | SPLD / FPGA | SPLD |
| Logic Elements / Cells | 24,320 | — |
| Macros (Logic Cells) | 2432 | — |
| Typical Gate Count | 600,000 gates | — |
| Embedded Memory | 311,296 bits | — |
| User I/Os | 488 to 508 | — |
| Nombre de broches | 652 (functional) / 672 (BGA balls) | — |
| Propagation Delay (typical) | 1.48 ns | — |
| Internal Frequency (max) | [DATA_NEEDED: max internal frequency in MHz] | — |
| Core Supply Voltage | 1.8 V | — |
| Process Technology | 0.15 µm all-layer copper | — |
| Température de fonctionnement | 0 °C to +85 °C (Industrial) | 0°C to 85°C |
| Package Type | 672-ball BGA, 45 x 45 mm, 1.27 mm pitch | — |
| Type de montage | Surface Mount | Surface mount |
| Statut RoHS | Compliant per legacy product records | unknown |
| Configuration Interface | JTAG / Passive Serial | — |
| Design Tool | Quartus II (legacy MAX+PLUS II) | — |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Boîtier | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | — | 672-pin FC-FBGA |
| Tension d'alimentation | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Propagation Delay | — | 1.48 ns |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |