EP2A25B652C8 vs EP2A25F672C7N Comparación
Comparación detallada lado a lado de EP2A25B652C8 por Altera y EP2A25F672C7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
EP2A25B652C8 ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP2A25B652C8 | EP2A25F672C7N |
|---|---|---|
| Marca | Altera | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $195,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | [DATA_NEEDED: exact LE count, ~16K-25K typical for EP2A25] | 24,320 cells |
| Maximum User I/O Pins | [DATA_NEEDED: per datasheet - approximate 380-420 for BGA-652] | — |
| Encapsulado | BGA-652 (FineLine BGA) | — |
| Pin/Ball Count | 652 | — |
| Speed Grade | -8 | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-micron CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM, ROM, CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| PLLs | [DATA_NEEDED: number, typically 4 for APEX II] | Up to 4 |
| Hardware Multipliers | Yes (dedicated DSP blocks) | — |
| LVDS Support | Yes (multi-gigabit LVDS pairs) | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: per datasheet label, most APEX II BGA parts are lead-free but non-RoHS] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: per datasheet] | — |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |