EP2A25B652C8 vs EP2A25F672C7N Comparaison
Comparaison détaillée côte à côte de EP2A25B652C8 par Altera et EP2A25F672C7N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
EP2A25B652C8 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2A25B652C8 | EP2A25F672C7N |
|---|---|---|
| Marque | Altera | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $195,00 |
| Series | APEX II | — |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | [DATA_NEEDED: exact LE count, ~16K-25K typical for EP2A25] | 24,320 cells |
| Maximum User I/O Pins | [DATA_NEEDED: per datasheet - approximate 380-420 for BGA-652] | — |
| Boîtier | BGA-652 (FineLine BGA) | — |
| Pin/Ball Count | 652 | — |
| Speed Grade | -8 | — |
| Température de fonctionnement | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-micron CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM, ROM, CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| PLLs | [DATA_NEEDED: number, typically 4 for APEX II] | Up to 4 |
| Hardware Multipliers | Yes (dedicated DSP blocks) | — |
| LVDS Support | Yes (multi-gigabit LVDS pairs) | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | [DATA_NEEDED: per datasheet label, most APEX II BGA parts are lead-free but non-RoHS] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: per datasheet] | — |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |