EP2A25F1020C8ES vs EP2A15F672C7 Comparación
Comparación detallada lado a lado de EP2A25F1020C8ES por Intel y EP2A15F672C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F1020C8ES | EP2A15F672C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $98,00 |
| Family | APEX II | APEX II FPGA |
| Logic Elements | 24,320 | — |
| System Gates | 2,750,000 | — |
| Embedded Memory (bits) | 622,592 | — |
| Maximum User I/O | 735 | 492 |
| Encapsulado | 1020-ball FineLine BGA | 672-ball FineLine BGA (FCBGA) |
| Package Code Suffix | F1020 | — |
| Speed Grade | 8 | C7 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Suffix Code | ES (Engineering Sample) | — |
| Core Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Technology | [DATA_NEEDED: process node] | 0.15 µm all-layer copper, up to 8 metal layers |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II (EP2A15) |
| Logic Elements (LE) | — | 16,640 |
| Total System Gates | — | 425,984 |
| Embedded Memory Bits | — | 425,984 |
| Number of Macrocells / Logic Units | — | 16,640 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Core Voltage | — | 1.5 V |
| High-Speed I/O Standard | — | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | — | 1 Gbps |
| Package Dimensions | — | 27 mm × 27 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | — | Commercial (0°C to +85°C) |