EP2A25F1020C8ES vs EP2A15F672C7 对比
详细并排对比 EP2A25F1020C8ES 出自 Intel 和 EP2A15F672C7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A25F1020C8ES | EP2A15F672C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $165.00 | $98.00 |
| Family | APEX II | APEX II FPGA |
| Logic Elements | 24,320 | — |
| System Gates | 2,750,000 | — |
| Embedded Memory (bits) | 622,592 | — |
| Maximum User I/O | 735 | 492 |
| 封装 | 1020-ball FineLine BGA | 672-ball FineLine BGA (FCBGA) |
| Package Code Suffix | F1020 | — |
| Speed Grade | 8 | C7 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Suffix Code | ES (Engineering Sample) | — |
| Core Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Technology | [DATA_NEEDED: process node] | 0.15 µm all-layer copper, up to 8 metal layers |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | 3 (168 Hours) | — |
| Packaging | Tray | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II (EP2A15) |
| Logic Elements (LE) | — | 16,640 |
| Total System Gates | — | 425,984 |
| Embedded Memory Bits | — | 425,984 |
| Number of Macrocells / Logic Units | — | 16,640 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Core Voltage | — | 1.5 V |
| High-Speed I/O Standard | — | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | — | 1 Gbps |
| Package Dimensions | — | 27 mm × 27 mm, 1.0 mm pitch |
| 工作温度 | — | Commercial (0°C to +85°C) |