EP2A40F1020C8 vs EP2A40F1020C8N Comparación
Comparación detallada lado a lado de EP2A40F1020C8 por Intel y EP2A40F1020C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F1020C8 | EP2A40F1020C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $310,00 | $0,00 |
| Family | APEX II | — |
| Logic Family | CMOS | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | 38,400 |
| Macros / Macro Cells | 2,560 | — |
| Embedded RAM | [DATA_NEEDED: total ESB bits] | — |
| Maximum Internal Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Package Type | FC-FBGA (FineLine BGA) | FC-FBGA, BGA-1020 |
| Package Pin Count | 1020 | — |
| Package Dimensions | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | 1 mm |
| Temperatura de funcionamiento | 0 C to +85 C (commercial, 'C' suffix) | 0 °C to 85 °C |
| Estado RoHS | [DATA_NEEDED: confirm per lot] | unknown |
| Configuration Interface | JTAG / Altera serial | — |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Body Size | — | 33 mm x 33 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Tipo de montaje | — | Surface Mount |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |