EP2A40F1020C8 vs EP2A40F1020C8N Comparaison
Comparaison détaillée côte à côte de EP2A40F1020C8 par Intel et EP2A40F1020C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F1020C8 | EP2A40F1020C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $310,00 | $0,00 |
| Family | APEX II | — |
| Logic Family | CMOS | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | 38,400 |
| Macros / Macro Cells | 2,560 | — |
| Embedded RAM | [DATA_NEEDED: total ESB bits] | — |
| Maximum Internal Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Package Type | FC-FBGA (FineLine BGA) | FC-FBGA, BGA-1020 |
| Package Pin Count | 1020 | — |
| Package Dimensions | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | 1 mm |
| Température de fonctionnement | 0 C to +85 C (commercial, 'C' suffix) | 0 °C to 85 °C |
| Statut RoHS | [DATA_NEEDED: confirm per lot] | unknown |
| Configuration Interface | JTAG / Altera serial | — |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Body Size | — | 33 mm x 33 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Type de montage | — | Surface Mount |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |