EP2A40F672C6N vs EP2A40F672C7N Comparación
Comparación detallada lado a lado de EP2A40F672C6N por Intel y EP2A40F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C6N | EP2A40F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $198,00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | — |
| Maximum System Gates | 1,125,000 | — |
| Embedded RAM Bits | 442,368 | — |
| Embedded System Blocks (ESBs) | 160 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | — |
| Encapsulado | 672-ball FineLine BGA | 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | Commercial (0C to +85C) | 0 °C to 85 °C (commercial, 'C' grade) |
| Speed Grade | C6 (per part number suffix) | 7 |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Logic Elements / Cells | — | 38,400 |
| System Gates | — | 1.5 M |
| Maximum User I/Os | — | 492 |
| Propagation Delay (tpd) | — | 1.55 ns |
| Internal Performance | — | 562 MHz |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |