EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel
N.º de pieza: EP2A40F672C6N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $210 | $21.000,00 |
| 500 | $185 | $92.500,00 |
| 1.000 | $165 | $165.000,00 |
EP2A40F672C6N Descripción general
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic through configuration of on-chip lookup tables, embedded memory blocks, and routing resources. APEX II sits in the hierarchy between low-density CPLDs and high-end SoC FPGAs, providing high logic density for data-path, DSP, and multi-protocol bridging applications. The EP2A40 is the largest member of the APEX II family, doubling the logic capacity of the EP2A25 while maintaining the same Quartus II design flow.
Key features include MultiVolt I/O support for direct interfacing to 1.8 V, 2.5 V, 3.3 V, and 5 V buses without level shifters, dedicated clock management with PLL-based clock tree synthesis, and high-bandwidth embedded memory suitable for FIFO, dual-port RAM, and content-addressable memory. The FastTrack interconnect provides predictable timing across the entire device, simplifying timing closure for wide data buses. The 672-ball FineLine BGA package exposes the maximum number of user I/O for the EP2A40 die, making it suitable for high-pin-count interface aggregation.
The APEX II architecture combines four-input look-up tables grouped into Logic Array Blocks (LABs), each LAB containing ten LEs plus local interconnect. ESBs (Embedded System Blocks) provide 2 Kbits of dual-port RAM each and can be cascaded to form wider or deeper memories. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL I/O standards, with per-pin slew-rate and drive-strength control. Configuration is supported via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes.
Typical applications include high-speed data-path bridging, multi-channel protocol conversion (e.g., SPI to parallel), glue-logic aggregation in ASIC prototypes, telecom line-card backplane interfacing, and industrial imaging pre-processing. The large logic capacity supports soft-core processor implementations such as the Nios embedded processor within the Quartus II tool flow. The wide I/O count enables direct connection to DDR-style memory buses and parallel ADC/DAC interfaces.
Designers should verify availability before starting new designs because APEX II is an older-generation family that has been superseded by Cyclone, Arria, and Stratix families. Existing designs typically rely on the Quartus II v5.0 or earlier toolchain for synthesis, place-and-route, and timing analysis. Power estimation should include both static and dynamic components, with thermal management important at high toggle rates.
This page synthesizes distributor stock signals, drop-in same-package variants within the APEX II family, and practical design notes not found in a single manufacturer document.
Alternativas directas para EP2A40F672C6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2A40F672C6N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Operating Temperature, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2A40F672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40F672I7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40F672C6
✅ Sustitución directa✓ En stock
$105 / unidad
Ver hoja de datos →EP2A40F1020C6N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40F1020C7N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP2A40F1020I7N
✅ Sustitución directa✓ En stock
$142 / unidad
Ver hoja de datos →EP2A40F672C6N Valores máximos y características eléctricas
| Family | APEX II |
| Logic Elements | 40,000 |
| Maximum System Gates | 1,125,000 |
| Embedded RAM Bits | 442,368 |
| Embedded System Blocks (ESBs) | 160 |
| Core Voltage | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Encapsulado | 672-ball FineLine BGA |
| Temperatura de funcionamiento | Commercial (0C to +85C) |
| Speed Grade | C6 (per part number suffix) |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG |
| Tipo de montaje | Surface Mount |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) |
Guía de configuración de pines de EP2A40F672C6N 672-ball fineline bga
Configuración de pines para EP2A40F672C6N (encapsulado 672-ball fineline bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2A40F672C6N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2A40F672C6N es adecuado para 6 aplicacións: High-Density ASIC Prototyping, Multi-Protocol Bridge and Interface Aggregation, Telecom Line Card Backplane Interface, Industrial Imaging Pre-Processing Pipeline, Digital Signal Processing Pre-Processor, Legacy Avionics and Defense Retrofit.
High-Density ASIC Prototyping
The EP2A40F672C6N provides approximately 40,000 logic elements and 442 Kbits of embedded SRAM, making it suitable for prototyping complex ASIC designs before tape-out. Its APEX II architecture mirrors mid-range ASIC gate-array structures, allowing RTL to be validated on real hardware. The 672-ball FineLine BGA exposes enough user I/O to map wide ASIC buses, and the Quartus II flow supports incremental compilation for fast design iterations.
Recomendado
Multi-Protocol Bridge and Interface Aggregation
With MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5 V standards simultaneously and over 400 user I/O pins, the EP2A40F672C6N is ideal for bridging between legacy and modern buses in telecom and industrial systems. Engineers use it to aggregate SPI, I2C, UART, and parallel interfaces into a single high-speed link. The 160 embedded system blocks provide FIFO buffers for protocol conversion without external memory.
Recomendado
Telecom Line Card Backplane Interface
The EP2A40F672C6N's high logic capacity and MultiVolt I/O make it well suited for telecom line cards that aggregate TDM, Ethernet, and serial RapidIO traffic across a backplane. Its HSTL and SSTL I/O support enables direct connection to high-speed memory buses used in packet buffering. The device's FastTrack interconnect provides deterministic timing required for backplane-grade signal integrity at rates up to 133 MHz.
Recomendado
Industrial Imaging Pre-Processing Pipeline
Industrial camera and machine-vision systems benefit from the EP2A40F672C6N's combination of wide LVCMOS/LVTTL I/O for direct camera-sensor connection and embedded dual-port RAM for line-buffer storage. The 40,000 logic elements support real-time Bayer demosaicing, color-space conversion, and histogram equalization at pixel-clock rates up to 80 MHz. Its commercial temperature range suits factory-floor enclosures with controlled climate.
Recomendado
Digital Signal Processing Pre-Processor
The EP2A40F672C6N integrates 442 Kbits of embedded SRAM and supports up to 160 ESBs which can implement multiplier arrays and shift-register FIR filters. With 40,000 logic elements it can host multi-channel audio DSP, software-defined radio baseband processing, or pre-DSP filtering before handing off to a dedicated DSP or ASIC. The high I/O count enables direct connection to parallel ADC and DAC devices.
Recomendado
Legacy Avionics and Defense Retrofit
Many long-lifecycle avionics, defense, and industrial-automation platforms continue to require APEX II logic for spare-part and obsolescence-management reasons. The EP2A40F672C6N serves as a form-fit-function replacement for boards originally designed around APEX II in MIL-STD-1553, ARINC 429, and proprietary backplane systems. The 672-ball FineLine BGA matches existing PCB footprints, avoiding costly board respins.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2A40F672C6N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2A40F672C7N | EP2A40F672I7N | EP2A40F672C6 | EP2A40F1020C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 1020-pin BGA - larger |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Speed Grade | C6 | C7 (faster) | I7 | C6 | C6 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Embedded System Blocks | 160 | 160 | 160 | 160 | 160 |
| Embedded RAM | 442,368 bits | 442,368 bits | 442,368 bits | 442,368 bits | 442,368 bits |
| Lead-Free (N suffix) | Yes | Yes | Yes | No (lead-bearing) | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Same-package speed grade upgrade (frente a EP2A40F672C7N)
- Industrial temperature option in same package (frente a EP2A40F672I7N)
- Higher I/O count in larger package (frente a EP2A40F1020C6N)
Notas de diseño
The EP2A40F672C6N core operates from a 1.5 V supply with separate VCCIO bank voltages for MultiVolt I/O. Per the APEX II datasheet, the I/O banks must each be decoupled with 0.1 uF and 10 uF capacitors placed within 5 mm of each bank-supply pin. The PLL analog supply (VCC_PLL) requires its own filtered 1.5 V rail to avoid jitter from core switching noise.
Estimated: at 100% toggle rate across all 40,000 logic elements with typical 25% switching activity, the EP2A40F672C6N dissipates approximately 3-5 W. The 672-ball FineLine BGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board. Designers should provide thermal vias under the BGA and at least a 2 oz copper pour on inner layers for reliable operation above 2 W.
Route all differential pairs (LVDS, GTL+) with 100 ohm differential impedance and matched lengths within 150 mil. Each ESB clock pin should be routed with controlled impedance and isolated from data signals by a ground guard trace. The configuration PROM (EPC16 or EPC8) should be placed within 2 inches of the FPGA DATA, DCLK, and nCONFIG pins to avoid configuration failures.
Do not mix 5 V and 3.3 V signals on the same I/O bank - each VCCIO bank must be tied to a single voltage level. Floating inputs can cause oscillation and excess Icc; all unused I/O pins must be set as outputs or tri-stated with the internal weak pull-up enabled. Configuration failures are commonly caused by missing or improperly sized pull-up resistors on nSTATUS, CONF_DONE, and nCONFIG pins.
Información de cumplimiento
Lead-free status confirmed by 'N' suffix per Altera/Intel ordering code convention. RoHS, REACH, and halogen-free status not extracted from verified web data; consult the manufacturer declaration or distributor certificate of conformance for current compliance status.