EP2A40F672C7ES vs EP2A40F672C6N Comparación
Comparación detallada lado a lado de EP2A40F672C7ES por Intel y EP2A40F672C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F672C7ES | EP2A40F672C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,75 | $165,00 |
| Family | APEX II | APEX II |
| Logic Elements | 38400 | 40,000 |
| Typical Gates | 1.5 M | — |
| Maximum Logic Elements | 40960 | — |
| Maximum Macro Cells | 2560 | — |
| Maximum User I/O | 492 | — |
| Maximum Operating Frequency | 562 MHz | — |
| Process Technology | 0.15 µm CMOS | SRAM-based, 0.18 um (per family datasheet) |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 3.3 V | — |
| Encapsulado | 672-pin FC-FBGA (FineLine BGA) | 672-ball FineLine BGA |
| Package Dimensions | 27 × 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 7 | C6 (per part number suffix) |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | Commercial (0C to +85C) |
| Status Code | ES (Engineering Sample) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Maximum System Gates | — | 1,125,000 |
| Embedded RAM Bits | — | 442,368 |
| Embedded System Blocks (ESBs) | — | 160 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O count] |
| Core Voltage | — | 1.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Configuration Methods | — | Passive Serial, Passive Parallel, JTAG |
| PLL Count | — | [DATA_NEEDED: PLL count] |