EP2AGX260EF29C5N vs EP2AGX260EF29I3G Comparación
Comparación detallada lado a lado de EP2AGX260EF29C5N por Intel y EP2AGX260EF29I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX260EF29C5N | EP2AGX260EF29I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.565,00 | $1.480,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial) | -40C to +100C (Industrial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 244,188 |
| Total RAM Bits | — | 12,038,144 |
| Number of Logic Blocks | — | [DATA_NEEDED: logic blocks count] |
| Number of Gates | — | [DATA_NEEDED: gate count] |
| Operating Frequency (max) | — | 500 MHz |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA |
| Lead Free | — | [DATA_NEEDED: lead-free status] |