EP2AGZ300FH29C4N vs EP2AGZ350FH29C3G Comparación
Comparación detallada lado a lado de EP2AGZ300FH29C4N por Intel y EP2AGZ350FH29C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ300FH29C4N | EP2AGZ350FH29C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.350,00 |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Adaptive Logic Modules (ALMs) | 119,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 18,854,912 | — |
| User I/O Pins | 281 | 281 |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | — |
| Transceivers | Up to 28 (up to 6.375 Gbps) | 24 channels |
| Core Voltage | 0.9 V | — |
| Process Node | 40 nm | 40 nm TSMC |
| Encapsulado | 780-ball FC-HFBGA (FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Speed Grade | C4 | C3 (commercial, slowest) |
| Temperature Grade | Industrial (N suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 350,000 |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Temperatura de unión de funcionamiento | — | 0C to +85C |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |