EP2AGZ350HF40C3N vs EP2AGZ225HF40C3N Comparación
Comparación detallada lado a lado de EP2AGZ350HF40C3N por Intel y EP2AGZ225HF40C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGZ350HF40C3N | EP2AGZ225HF40C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $1.820,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 224000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 8960 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Process Technology | 40 nm low-power | — |
| Encapsulado | 1517-ball FCBGA (HF40) | — |
| Operating Temperature Grade | Commercial (C3) | Industrial |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| User I/O Pins | — | 734 |
| Número de pines | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Nivel MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Process Node | — | 40 nm |
| Estado RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |