EP2AGZ350HF40C3N vs EP2AGZ225HF40C3N Comparaison
Comparaison détaillée côte à côte de EP2AGZ350HF40C3N par Intel et EP2AGZ225HF40C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGZ350HF40C3N | EP2AGZ225HF40C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 150,00 | $1 820,00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 224000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 8960 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Process Technology | 40 nm low-power | — |
| Boîtier | 1517-ball FCBGA (HF40) | — |
| Operating Temperature Grade | Commercial (C3) | Industrial |
| Configuration Mode | FPP / AS / JTAG | — |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| User I/O Pins | — | 734 |
| Nombre de broches | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Niveau MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Process Node | — | 40 nm |
| Statut RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |