EP2C8T144C6N vs EP2C8T144C7 Comparación
Comparación detallada lado a lado de EP2C8T144C6N por Intel y EP2C8T144C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8T144C6N | EP2C8T144C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,20 | $28,75 |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 8,256 | — |
| Total RAM Bits | 165,888 | 165,888 |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Elements / Cells | 8,256 | — |
| Total Memory Bits | 165,888 | — |
| Number of I/O | 85 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Voltage - Supply | 1.15 V to 1.25 V (core) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (Commercial, 'C' speed grade) |
| Encapsulado / Carcasa | 144-LQFP (TQFP) | — |
| Supplier Device Package | 144-TQFP (20x20 mm) | — |
| Tipo de montaje | Surface Mount | — |
| Process Technology | 90 nm CMOS SRAM | 90 nm CMOS, low-k dielectric |
| Configuration Method | SRAM - volatile (EPCS/JTAG required) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Contains lead / RoHS non-compliant |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements (LE) | — | 8,256 |
| Logic Array Blocks (LAB) | — | 516 |
| M4K Memory Blocks | — | 36 (4,608 bits each) |
| Embedded 18x18 Multipliers | — | 18 |
| PLLs | — | 4 |
| Maximum User I/O | — | 85 |
| Encapsulado | — | 144-LQFP (TQFP-144) |
| Core Voltage | — | 1.15 V to 1.25 V |
| I/O Voltage Support | — | 1.5V / 1.8V / 2.5V / 3.0V / 3.3V |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG |
| Speed Grade | — | 7 |