EP2S130F1020C3 vs EP2S130F1020I4 Comparación
Comparación detallada lado a lado de EP2S130F1020C3 por Intel y EP2S130F1020I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F1020C3 | EP2S130F1020I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.295,00 | $1.395,00 |
| Series | Stratix II | — |
| Family | Stratix II | Stratix II |
| Logic Elements / Cells | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/Os | 742 | — |
| Embedded Memory (TriMatrix) | [DATA_NEEDED: total Mbits] | — |
| DSP / Multiplier Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) | — |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Encapsulado / Carcasa | 1020-BBGA (FC-FBGA), 33x33 mm | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Tipo de montaje | Surface Mount | Surface Mount (FC-FBGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'C' speed grade) | — |
| Speed Grade | C3 (commercial, -3 speed) | I (industrial performance) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Encapsulado | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Device Revision | — | 4 |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |