EP2S130F1020C3 vs EP2S130F1020I4 Comparaison
Comparaison détaillée côte à côte de EP2S130F1020C3 par Intel et EP2S130F1020I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2S130F1020C3 | EP2S130F1020I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 295,00 | $1 395,00 |
| Series | Stratix II | — |
| Family | Stratix II | Stratix II |
| Logic Elements / Cells | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/Os | 742 | — |
| Embedded Memory (TriMatrix) | [DATA_NEEDED: total Mbits] | — |
| DSP / Multiplier Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) | — |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Boîtier / Format | 1020-BBGA (FC-FBGA), 33x33 mm | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Type de montage | Surface Mount | Surface Mount (FC-FBGA) |
| Température de fonctionnement | 0C to +85C (commercial, 'C' speed grade) | — |
| Speed Grade | C3 (commercial, -3 speed) | I (industrial performance) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Boîtier | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Device Revision | — | 4 |
| Température de jonction en fonctionnement | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |