EP2S130F1020C3NGA - Stratix II FPGA, 132K LE, FC-FBGA-1020 | Intel
N.º de pieza: EP2S130F1020C3NGA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1480 | $740.000,00 |
| 1.000 | $1395 | $1.395.000,00 |
EP2S130F1020C3NGA Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that belongs to the broader category of programmable logic devices (PLDs). Within the system hierarchy, FPGAs sit between fixed-function ASICs and software-defined processors: they offer hardware-level parallelism and deterministic timing like ASICs, while retaining post-fabrication reprogrammability. Stratix II devices use a logic-structure (LE) based architecture with embedded DSP blocks, TriMatrix memory, and high-speed transceivers, making them the building blocks of complex DSP, communications, and protocol-bridging subsystems.
Key features of the EP2S130F1020C3NGA include 132,540 logic elements, 6.7 Mbits of TriMatrix embedded SRAM, embedded DSP blocks for high-throughput multiply-accumulate operations, 12 on-chip PLLs for clock synthesis, and dedicated high-speed I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL signaling. The 1020-ball FC-FBGA package offers a high signal/power density suited to multi-gigabit serial interfaces and parallel external memory buses. Hard IP for PCI Express, Gigabit Ethernet, and Serial RapidIO is available through Altera IP cores, reducing soft-logic overhead.
From an architectural standpoint, Stratix II uses an adaptive logic module (ALM) with 8 inputs, providing 1.4x the logic capacity of the previous Stratix generation at the same area. The 90 nm process enables a core voltage of 1.2 V and dynamic on-chip termination (OCT) for signal-integrity optimization without external resistors. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), or JTAG, with optional encryption using a 128-bit AES key.
Typical applications include high-performance digital signal processing (radar, software-defined radio, medical imaging), wireline backplane bridging, network processor offload, ASIC prototyping, and high-density protocol conversion. The combination of 742 user I/Os and on-chip PLLs also makes the device suitable for memory-intensive subsystems interfacing DDR/DDR2/QDRII SRAM.
Designers should use the Quartus II design software (version 6.1 or later for Stratix II) for synthesis, place-and-route, and timing closure; signal-integrity-driven board design with controlled-impedance routing is mandatory for LVDS and DDR interfaces above 200 MHz. The 1020-ball FC-FBGA requires a multi-layer PCB with microvia technology for breakout.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas directas para EP2S130F1020C3NGA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2S130F1020C3NGA (mismo factor de forma y huella) — difiere en Operating Temperature, Speed Grade, Package, Mounting Type, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2S130F1020C3N
✅ Sustitución directa✓ En stock
$1095 / unidad
Ver hoja de datos →EP2S130F1020C3
✅ Sustitución directa✓ En stock
$1295 / unidad
Ver hoja de datos →EP2S180F1020C3
✅ Sustitución directa✓ En stock
$1280 / unidad
Ver hoja de datos →EP2S130F1020C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2800 / unidad
Ver hoja de datos →EP2S130F1020C5
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4100 / unidad
Ver hoja de datos →EP2S130F1020I4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1395 / unidad
Ver hoja de datos →EP2S130F1020C3NGA Valores máximos y características eléctricas
| Family | Stratix II |
| Logic Elements (LE) | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) |
| User I/Os | 742 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 778.82 MHz |
| Encapsulado | 1020-ball FC-FBGA |
| Speed Grade | C3 |
| Temperature Grade | Commercial (0C to +85C) |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | PS, PPS, PPA, JTAG |
| Configuration Encryption | 128-bit AES |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) |
Guía de configuración de pines de EP2S130F1020C3NGA 1020-ball fc-fbga
Configuración de pines para EP2S130F1020C3NGA (encapsulado 1020-ball fc-fbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2S130F1020C3NGA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2S130F1020C3NGA es adecuado para 6 aplicacións: High-Performance DSP / Software Defined Radio, ASIC Prototyping and Emulation, Wireline Backplane / Network Bridge, Medical Imaging / Ultrasound Beamforming, Industrial Control / Motion Controller, Video Broadcasting / Image Processing Pipeline.
High-Performance DSP / Software Defined Radio
The EP2S130F1020C3NGA's 132,540 logic elements and embedded 18x18 multiplier DSP blocks make it a strong fit for high-throughput DSP subsystems. In a software-defined radio (SDR) baseband, the FPGA typically implements FIR filtering, FFT/iFFT, channelization, and digital up/down-conversion, with the 6.7 Mbits of TriMatrix memory buffering sample streams between DSP blocks. The 12 on-chip PLLs generate the multiple clock domains needed for ADC/DAC sample rates and SERDES reference clocks. Compared with general-purpose DSP processors, this Stratix II delivers deterministic latency and parallel multiply-accumulate throughput at hundreds of MHz, critical for real-time radar and LTE baseband designs.
Recomendado
ASIC Prototyping and Emulation
With 132,540 LEs and 742 user I/Os, the EP2S130F1020C3NGA is frequently used to prototype and validate ASIC RTL before tape-out. Engineers map synthesized ASIC netlists into the FPGA using partition-based prototyping flows, leveraging the large logic capacity to absorb multi-million-gate designs or to run several smaller ASICs in parallel. The 1020-ball FC-FBGA exposes enough I/Os to bring out complete peripheral buses, debug headers, and trace ports. Quartus II's incremental compile and LogicLock regions allow iterative refinement of the prototype. The commercial C3 speed grade is typically sufficient for functional verification; production timing closure is then performed on the target ASIC process.
Recomendado
Wireline Backplane / Network Bridge
The EP2S130F1020C3NGA's high I/O count and embedded transceiver support (via soft IP for LVDS/gigabit serial) suits line-card and backplane bridging applications. In a typical design, the FPGA aggregates multiple SFP+/XFP optical links and forwards traffic across a network processor or switch ASIC via SPI-4.2 or Interlaken interfaces. The 742 user I/Os easily accommodate 24+ SERDES lanes with their reference clocks, GPIO, and management interfaces. On-chip TriMatrix memory buffers packets between the line side and the fabric side, reducing external SSRAM. The 1.2 V core keeps per-port power within line-card thermal budgets at full line rate.
Recomendado
Medical Imaging / Ultrasound Beamforming
In ultrasound and digital radiology systems, the EP2S130F1020C3NGA performs real-time beamforming, envelope detection, and image reconstruction. Each transducer channel requires a finite-impulse-response filter and delay line; with 132 DSP blocks available, the FPGA can process 64 to 128 channels at full RF sampling rates. The 6.7 Mbits of embedded memory holds per-channel delay coefficients and line buffers, eliminating external SRAM for many designs. Latency is deterministic because beamforming happens entirely in fabric. The commercial 0C to +85C temperature range fits the chassis environment of cart-based ultrasound systems.
Recomendado
Industrial Control / Motion Controller
The EP2S130F1020C3NGA can serve as a multi-axis motion controller in factory automation, where deterministic sub-microsecond loop times are required. Each axis uses the FPGA's DSP blocks for PID computation and S-curve profiling, with closed-loop feedback from incremental encoders via LVDS pairs. The 742 I/Os interface to stepper/servo drives via pulse-and-direction or analog +/-10 V outputs through companion DACs. The 12 PLLs generate per-axis PWM switching frequencies synchronized to a master time base, eliminating jitter between axes. Industrial users benefit from the AES-128 bitstream encryption that protects proprietary control algorithms.
Recomendado
Video Broadcasting / Image Processing Pipeline
Broadcast video routers, format converters, and image-processing pipelines use the EP2S130F1020C3NGA for real-time pixel-rate operations such as color-space conversion, scaling, deinterlacing, and overlay composition. With 742 user I/Os, the device can accept multiple HD-SDI or 3G-SDI inputs from serializer/deserializer chips while driving HDMI/DVI outputs and a parallel RGB panel interface. The 6.7 Mbits of TriMatrix memory holds multiple frame buffers and line delays needed for deinterlacing algorithms. Quartus II IP cores for SMPTE 292M/424M SDI and DVI/HDMI transmitters simplify integration.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2S130F1020C3NGA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2S130F1020C3N | EP2S130F1020C3 | EP2S180F1020C3 |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 179,400 (+35%) |
| Embedded Memory | 6.7 Mbits | 6.7 Mbits | 6.7 Mbits | 9.4 Mbits |
| User I/Os | 742 | 742 | 742 | 742 |
| Speed Grade | C3 | C3 | C3 | C3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial |
Diferenciadores clave
- Highest-density Stratix II device for ASIC prototyping (frente a EP2S90F1020C3)
- Slower C3 speed grade preserves timing margin at low cost (frente a EP2S130F1020C5)
- Commercial temperature range for cost-optimized designs (frente a EP2S130F1020I4)
Notas de diseño
The 1020-ball FC-FBGA package uses a 1.0 mm ball pitch on a 33x33 mm body. Per the Stratix II Device Handbook, PCB breakout requires laser-drilled microvias (0.1 mm or smaller) on the top signal layer with via-in-pad recommended for the inner rows. Stack the PCB as 8 or more layers with dedicated ground and power planes directly beneath the device; the flip-chip BGA needs a continuous ground plane to control return-current paths and EMI. Estimate: with 1 oz copper on outer layers and 0.5 oz on inner layers, the DC resistance of the via chain for a fully-utilized I/O ring is below 50 milliohms.
Stratix II devices at full utilization can dissipate 10 to 18 W. With theta_JA around 12 C/W on a JEDEC 4-layer test board, junction temperature rise above ambient is approximately 120 to 216 C at these power levels, exceeding the 125 C commercial limit. Mandatory thermal design: use a heat-spreader-equipped FC-FBGA variant where available, place thermal vias under the package center pad, and attach a heatsink with thermal interface material. Estimate: for 15 W dissipation with a 4 C/W heatsink, junction temperature rise is 60 C above ambient, requiring 25 C max inlet air.
Three common pitfalls: (1) Don't assume C3/C4/C5 are timing-compatible - migrating between speed grades requires Quartus II re-compilation and may change pin-to-pin timing margins. (2) Don't use JTAG and passive configuration simultaneously without isolating MSEL pins correctly, or the device may fail to configure. (3) Don't rely on the EPCS16 for production - the EP2S130F1020C3NGA bitstream exceeds 16 Mbit and requires an EPCS64 or larger. Always validate configuration at production corner cases (cold start, brown-out) using the ALTREMOTE_UPDATE IP if in-field updates are needed.
Información de cumplimiento
RoHS/REACH/AEC-Q100 status not present in verified web data; lead-free assumed from Intel/Altera product family datasheet convention but not verified per part number. AEC-Q100 not applicable for FPGAs.