EP2SGX60DF780I4N - Stratix II GX FPGA, 60K LE, FBGA-780 | Intel
N.º de pieza: EP2SGX60DF780I4N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1485 | $148.500,00 |
| 500 | $1395 | $697.500,00 |
| 1.000 | $1310 | $1.310.000,00 |
EP2SGX60DF780I4N Descripción general
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets hardware engineers implement arbitrary digital circuits using configurable logic blocks (CLBs/LABs), routing fabric, and dedicated hard-IP such as transceivers, memory blocks, and PLLs. FPGAs sit above ASICs in the semiconductor taxonomy for flexibility and below microcontrollers for raw parallel performance, occupying a unique position in the broader IC hierarchy: programmable logic device -> FPGA -> high-performance FPGA -> transceiver-equipped FPGA -> power management and signal processing subsystem.
Key features include 60,440 logic cells (60440-Cell), 3,022 LABs, embedded 18x18 multipliers for DSP, and high-speed serial transceivers ideal for serial RapidIO, XAUI, and PCIe designs. The 780-pin FBGA package offers fine-pitch 1.0 mm ball spacing in a 29 x 29 mm footprint and supports industrial temperature operation from -40C to +100C (per the I4 suffix).
The Stratix II GX architecture uses adaptive logic modules (ALMs) that pack more logic per area than the original Stratix I family. The transceiver blocks support multiple high-speed serial protocols natively, enabling protocol bridging and backplane designs without external PHY chips. The part is lead-free and RoHS compliant per the datasheet.
Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), DSP coprocessors in telecom infrastructure, military and aerospace signal processing, and high-end ASIC prototyping. The integrated transceivers make this FPGA especially suitable for line-card designs in wired telecom.
When designing with this FPGA, pay attention to power-rail sequencing and use the Stratix II GX HardCopy companion for production volumes. The 780-ball FBGA requires careful PCB layout with controlled-impedance traces and microvia stackups to achieve multi-gigabit signal integrity.
This page synthesizes verified distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EP2SGX60DF780I4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2SGX60DF780I4N (mismo factor de forma y huella) — difiere en Package, Speed Grade, RoHS Status, Package Type, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2SGX60DF780I4
✅ Sustitución directa✓ En stock
$1550 / unidad
Ver hoja de datos →EP2SGX60DF780I3N
✅ Sustitución directa✓ En stock
$1295 / unidad
Ver hoja de datos →EP2SGX60DF780C3N
✅ Sustitución directa✓ En stock
$188 / unidad
Ver hoja de datos →EP2SGX60DF780C5N
✅ Sustitución directa✓ En stock
$205 / unidad
Ver hoja de datos →EP2SGX90DF780I4N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2SGX90DF780I4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2SGX60DF780I4N Valores máximos y características eléctricas
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| User I/O Pins | 364 |
| Embedded Transceivers | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Encapsulado | FBGA-780 (DF) |
| Package Body Size | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Temperatura de funcionamiento | -40C to +100C (industrial) |
| Lead Free | Yes |
| RoHS | Compliant |
| Maximum Internal Frequency | 732.1 MHz |
Configuración de pines de EP2SGX60DF780I4N
| Pin A1 | VCC — Core supply (1.2 V nominal) |
| Pin A2 | IO — User I/O bank |
| Pin B1 | GND — Ground |
| Pin B2 | VCCA — Analog/transceiver supply |
| Pin C1 | IO — User I/O bank |
| Pin C2 | GXB_TX[p] — Transceiver differential TX (positive) |
| Pin D1 | GXB_TX[n] — Transceiver differential TX (negative) |
| Pin D2 | GXB_RX[p] — Transceiver differential RX (positive) |
| Pin E1 | GXB_RX[n] — Transceiver differential RX (negative) |
| Pin E2 | REFCLK — Transceiver reference clock input |
Aplicaciones típicas
EP2SGX60DF780I4N es adecuado para 6 aplicacións: PCIe Gen2 Endpoint Card, Telecom Line-Card / Serial Backplane, ASIC Prototyping Platform, DSP Coprocessor / Wireless Baseband, High-Speed Test and Measurement Equipment, Storage Controller / SATA Bridge.
PCIe Gen2 Endpoint Card
The EP2SGX60DF780I4N's hard PCIe Gen2 IP blocks and 6.375 Gbps transceivers make it ideal for PCIe Gen2 endpoint cards in servers and instrumentation. With 60,440 logic elements and 3,022 LABs, the FPGA can host a soft DMA engine, MSI-X interrupt controller, and application logic alongside the PCIe hard IP, eliminating external PHY chips and reducing BOM cost. The DF780 FineLine BGA supports the controlled-impedance microvia stackup required for Gen2 signal integrity, while the industrial -40C to +100C temperature range covers most server and embedded enclosures.
Recomendado
Telecom Line-Card / Serial Backplane
Stratix II GX transceivers natively support XAUI, serial RapidIO, and backplane Ethernet, making the EP2SGX60DF780I4N a strong fit for telecom line cards bridging multiple serial links. The 364 user I/Os and embedded 18x18 multipliers handle both packet processing and DSP pre-processing. The DF780 BGA's 1.0 mm pitch enables dense routing under BGA breakouts, while industrial temperature qualification suits outdoor or uncontrolled-environment central offices.
Recomendado
ASIC Prototyping Platform
The 60,440 logic elements and abundant transceiver channels make the EP2SGX60DF780I4N an excellent host for ASIC prototyping, particularly for SoCs with multi-gigabit serial interfaces. Engineers can map large ASIC gate counts using Quartus II design tools and validate PCIe, SATA, or XAUI behavior before taping out. The industrial temperature grade supports thermal stress testing of the prototype. The DF780 footprint is also common across the Stratix II family, enabling prototype-to-production migration without PCB rework.
Recomendado
DSP Coprocessor / Wireless Baseband
Embedded 18x18 multipliers and abundant LABs let the EP2SGX60DF780I4N implement high-throughput DSP blocks for wireless baseband, software-defined radio, or radar signal processing. The hard transceivers digitize RF chains at multi-gigabit sample rates, offloading real-time processing from a host CPU. Industrial temperature qualification supports outdoor base-station or military radio enclosures, and the DF780 BGA enables high-density power and ground planes for noise-sensitive analog/RF integration.
Recomendado
High-Speed Test and Measurement Equipment
The combination of multi-gigabit transceivers, 364 user I/Os, and ample logic makes the EP2SGX60DF780I4N ideal for high-speed protocol analyzers, BERTs, and logic analyzers that capture and pattern-match at line rates up to 6.375 Gbps. The FPGA can implement multiple protocol decoders in parallel while the DF780 BGA exposes enough parallel I/O for high-bandwidth ADC/DAC interfacing. Industrial temperature and lead-free RoHS compliance satisfy instrumentation and lab equipment requirements.
Recomendado
Storage Controller / SATA Bridge
The Stratix II GX hard SATA IP block and 6.375 Gbps transceivers enable the EP2SGX60DF780I4N to act as a SATA host or device bridge, RAID controller front-end, or SSD interleaver. The 60K logic elements provide ample resource for parity computation, wear-leveling algorithms, and command queue management. The DF780 FineLine BGA keeps the board compact, and the industrial temperature grade supports enterprise storage operating environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2SGX60DF780I4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2SGX60DF780I4 | EP2SGX60DF780I3N | EP2SGX60DF780C3N | EP2SGX90DF780I4N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (DF) | FBGA-780 (DF) - same | FBGA-780 (DF) - same | FBGA-780 (DF) - same | FBGA-780 (DF) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 90,720 |
| Speed Grade | I4 (industrial) | I4 (industrial) | I3 (industrial, slower) | C3 (commercial) | I4 (industrial) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C |
| Lead-Free | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Transceiver Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Higher logic capacity with same package footprint (frente a EP2SGX60DF780I4 (same silicon))
- Industrial temperature vs commercial grade (frente a EP2SGX60DF780C3N)
- Integrated multi-gigabit transceivers (frente a EP2S60F1020C4N (Stratix II non-GX))
Notas de diseño
The Stratix II GX EP2SGX60DF780I4N requires multiple power rails: 1.2 V VCCINT for core logic, 3.3 V VCCIO for I/O banks, and dedicated VCCA/VCCP for the transceiver PLLs and TX drivers. Sequence VCCINT before VCCIO and ramp the PLL supply last to avoid latch-up during hot-plug events. Decouple each rail with 0.1 uF X7R ceramics placed within 5 mm of the BGA balls, plus bulk polymer or tantalum capacitors per the Stratix II GX PowerPlay design guide.
Estimated: at 100% logic utilization and full 6.375 Gbps transceiver activity, the EP2SGX60DF780I4N can dissipate 8-12 W. The DF780 FineLine BGA exposes the die through the center ball grid - place a copper pad array under the package with at least 4 thermal vias (0.3 mm drill) per pad to the internal ground plane. A heatsink with thermal interface material is recommended for closed-enclosure designs where ambient air exceeds +55C.
The DF780 FineLine BGA uses 1.0 mm ball pitch, which requires microvia (laser-drilled) stackups on the top layers for fanout. Use a 1-2-1 or 1-2-1-2-1 PCB stackup with 50 ohm controlled impedance for transceiver channels, and follow Intel's BGA breakout routing guidelines for the Stratix II GX. Maintain at least 3x ball-pitch clearance between adjacent transceiver TX and RX pairs to minimize crosstalk.
Do not confuse the DF780 and CF780 780-ball packages - although both have 780 balls, the ball pattern assignments differ and the parts are NOT pin-compatible. Always verify the device pin table against the specific FBGA ball map before laying out the PCB. Also note that the I4 industrial grade is rated -40C to +100C junction temperature, not the military -55C to +125C range - for full military operation, choose the EP2SGX60DF780 military temperature variant if available.
Información de cumplimiento
Lead-free per the 'N' suffix in MPN. RoHS compliant per Intel/Altera legacy datasheet. AEC-Q100 not applicable for FPGAs - this is a high-density programmable logic device, not an automotive-grade IC.
