EP3C16F256I7N vs EP3C25F256I7N Comparación
Comparación detallada lado a lado de EP3C16F256I7N por Intel y EP3C25F256I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F256I7N | EP3C25F256I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,50 | $27,20 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 608,256 bits |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Maximum User I/O Pins | 168 | — |
| Encapsulado | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Temperatura de funcionamiento | -40C to +100C (industrial, I7) | -40C to +125C |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm low-power |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | SRAM-based, in-system programmable |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | FPGA |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Tipo de montaje | — | Surface Mount |
| Estado RoHS | — | Compliant (lead-free) |
| Hot Socketing | — | Supported |