EP3C16F256I7N vs EP3C25F256I7N Comparison
Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C25F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C16F256I7N | EP3C25F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 608,256 bits |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Maximum User I/O Pins | 168 | — |
| Package | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (industrial, I7) | -40C to +125C |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm low-power |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | SRAM-based, in-system programmable |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | FPGA |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Mounting Type | — | Surface Mount |
| RoHS Status | — | Compliant (lead-free) |
| Hot Socketing | — | Supported |