EP3C25F324I7N vs EP3C25F324C8 Comparación
Comparación detallada lado a lado de EP3C25F324I7N por Intel y EP3C25F324C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324I7N | EP3C25F324C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,20 | $23,10 |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | 608,256 bits |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Encapsulado | 324-ball FBGA (Fine-Pitch BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0 °C to +85 °C (commercial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Speed Grade | 7 (slower speed grade, lower power) | 8 (commercial) |
| Estado RoHS | Compliant | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Lead-Free | Yes | — |
| Nivel MSL | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Multipliers | — | 66 (18 x 18) |
| User I/Os | — | 215 |
| Tipo de montaje | — | Surface Mount (BGA) |
| Maximum Internal Clock | — | 402 MHz |