EP3C55F780C6 vs EP3C55F780C8N Comparación
Comparación detallada lado a lado de EP3C55F780C6 por Intel y EP3C55F780C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C6 | EP3C55F780C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $209,22 | $58,20 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Encapsulado | 780-ball FBGA | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | -6 (C6) | 8 (commercial, slowest) |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm low power | 65 nm TSMC low-power |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Family | — | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| Maximum User I/O | — | 377 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |