EP3C55F780C6 vs EP3C55F780C8N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6 von Intel und EP3C55F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6 | EP3C55F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $209,22 | $58,20 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Gehäuse | 780-ball FBGA | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | -6 (C6) | 8 (commercial, slowest) |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm low power | 65 nm TSMC low-power |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Montageart | Surface Mount (BGA) | — |
| Family | — | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Embedded 18x18 Multipliers | — | 156 |
| PLLs | — | 4 |
| Maximum User I/O | — | 377 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |