EP3C5F256C7N vs EP3C5F256I7N Comparación
Comparación detallada lado a lado de EP3C5F256C7N por Intel y EP3C5F256I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256C7N | EP3C5F256I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,20 | $24,00 |
| Family | Cyclone III | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LEs) | 5,136 | — |
| Logic Array Blocks (LABs) | 182 | — |
| Total Embedded Memory | 423,936 bits (414 Kbit) | — |
| Embedded Multipliers (18x18) | 23 | 26 |
| M9K Memory Blocks | 46 | — |
| User I/Os | 182 | — |
| User I/O Banks | 8 | — |
| PLLs | 2 | 2 |
| Encapsulado | 256-LBGA (FineLine BGA, 17x17 mm) | 256-FBGA (FineLine BGA) |
| Speed Grade | -7 (commercial, slowest C-tier) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, per 'C' speed bin) | -40C to +125C (Industrial) |
| Core Voltage | 1.2 V (nominal) | — |
| Process Technology | 65 nm low-power CMOS | TSMC 65nm low-power |
| Lead-Free / Pb-Free | Yes (suffix 'N' denotes lead-free) | — |
| Configuration Modes | JTAG, AS, AP, PS | Active Serial, Passive Serial, JTAG, FPP |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Nivel MSL | — | 3 (168 hours) |
| Tipo de montaje | — | Surface Mount (BGA) |