EP3SE110F1152C2NES vs EP3SE110F1152C3N Comparación
Comparación detallada lado a lado de EP3SE110F1152C2NES por Altera y EP3SE110F1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE110F1152C2NES | EP3SE110F1152C3N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.320,00 | $1.560,00 |
| Family | Stratix III Enhanced (EP3SE110) | Stratix III E |
| Manufacturer | Altera (Intel) | — |
| Process Technology | 65 nm | 65 nm TSMC |
| Logic Elements | 107,500 | — |
| User I/O Pins | 744 | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 600 MHz | — |
| Encapsulado | FC-FBGA-1152 (Flip-Chip) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: temperature grade] | — |
| Speed Grade | C2 | C3 |
| Tipo de memoria | Embedded M9K blocks | M9K and M144K block RAM |
| DSP Blocks | Yes (variable-precision DSP) | Yes (embedded multipliers) |
| Transceivers | [DATA_NEEDED: transceiver count] | — |
| Configuration | SRAM-based, volatile | — |
| Programming Interface | JTAG / Passive Serial / Fast Passive Parallel | — |
| Toolchain | Quartus II (Stratix III support) | — |
| Estado RoHS | Non-Compliant (per Kynix listing) | — |
| Series | — | Stratix III |
| Logic Elements (LE) | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Total RAM Bits | — | 8,936,448 |
| User I/Os | — | 744 |
| Operating Frequency (max) | — | 500 MHz |
| Core Supply Voltage | — | 1.1 V nominal |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply range] |
| Package Type | — | FC-FBGA-1152 (flip-chip BGA) |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (commercial) |
| Estilo de montaje | — | SMD/SMT (Tray) |
| External Memory Support | — | DDR/DDR2/DDR3 with read/write leveling |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| RoHS | — | [DATA_NEEDED: RoHS status] |
| Lead-Free | — | Yes (per Altera/Intel datasheet family convention) |