EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
N.º de pieza: EP3SE110F1152C4N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1480 | $740.000,00 |
| 1.000 | $1395 | $1.395.000,00 |
EP3SE110F1152C4N Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic devices, but offer the highest logic density and the highest performance-per-watt ceiling in the FPGA category. The Stratix III family is positioned for memory-rich and multiplier-rich data-centric designs.
Key features of the EP3SE110F1152C4N include 107,500 logic elements, 8,936,448 memory bits, 744 user I/O pins, support for high-speed transceivers in companion family members, and best-in-class signal integrity through dynamic on-chip termination, output delay, and current strength control. The E-family variant emphasizes embedded memory and DSP blocks for DSP-intensive workloads such as wireless baseband, video processing, and high-performance computing.
The device architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe. Configuration is via passive serial, fast passive parallel, or JTAG, with optional encryption using AES-256. The 65 nm process delivers a favorable performance-per-watt ratio compared to the prior 90 nm Stratix II generation.
Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, baseband processing), high-performance computing accelerators, ASIC prototyping, broadcast video processing, and military/aerospace signal processing. The E variant is specifically tuned for memory- and multiplier-rich DSP workloads.
Design considerations include the use of the Quartus II design software (version 9.1 or later for full Stratix III support), multi-rail power decoupling with bulk, ceramic, and high-frequency bypass capacitors, controlled-impedance PCB routing for high-speed I/O, and thermal management via the Flip-Chip BGA exposed die for heat-spreader attachment. Power estimation should use the Quartus PowerPlay Early Power Estimator before place-and-route.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet view. For full pinout, electrical characteristics, and configuration bitstream generation, consult the official Intel Stratix III Device Handbook.
Alternativas directas para EP3SE110F1152C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE110F1152C4N (mismo factor de forma y huella) — difiere en Operating Temperature, Speed Grade, Family, Package, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE110F1152C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1560 / unidad
Ver hoja de datos →EP3SE110F1152C4LN
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3510 / unidad
Ver hoja de datos →EP3SE110F1152C4L
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3372.13 / unidad
Ver hoja de datos →EP3SE110F1152C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2200 / unidad
Ver hoja de datos →EP3SL110F1152C2N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP3SE110F1152C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3200 / unidad
Ver hoja de datos →EP3SE110F1152C4N Valores máximos y características eléctricas
| Family | Stratix III Enhanced (E) |
| Logic Elements | 107,500 |
| Memory Bits | 8,936,448 |
| Embedded Multipliers (18x18) | 896 |
| Logic Array Blocks (LABs) | 4300 |
| User I/O Pins | 744 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 450 MHz |
| Encapsulado | 1152-ball FCBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0C to +85C (Commercial) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (168 hours) |
| Design Software | Quartus II (v9.1 or later) |
Guía de configuración de pines de EP3SE110F1152C4N 1152-ball fcbga (flip-chip bga)
Configuración de pines para EP3SE110F1152C4N (encapsulado 1152-ball fcbga (flip-chip bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE110F1152C4N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE110F1152C4N es adecuado para 6 aplicacións: 10G/40G Ethernet Line Card Processing, Wireless Baseband DSP Processing, High-Performance Computing Accelerator, Broadcast Video Processing and Format Conversion, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing.
10G/40G Ethernet Line Card Processing
The EP3SE110F1152C4N fits 10G/40G Ethernet line card designs where 107,500 logic elements provide packet-classification capacity and 896 embedded 18x18 multipliers handle packet-header checksum and IPsec acceleration. Its 8,936,448 memory bits buffer packet descriptors and queue structures, while the 744 user I/Os interface directly to SFP+ and QSFP+ PHY devices via LVDS/HSTL. The 1.1 V core and 65 nm process deliver a favorable performance-per-watt ratio for chassis-based systems with constrained airflow. Compared to a Stratix IV equivalent, the Stratix III E variant trims power by 30-40% while maintaining 450 MHz internal fabric speed, making it ideal for dense multi-port line cards.
Recomendado
Wireless Baseband DSP Processing
The EP3SE110F1152C4N's 896 embedded 18x18 multipliers deliver 100s of GMACs of DSP throughput, ideal for LTE, WiMAX, and proprietary PHY-layer baseband processing in macro and small-cell base stations. The TriMatrix memory hierarchy (MLAB + M9K + M144K) provides on-chip storage for symbol buffers and FFT windows, eliminating external SRAM access for moderate FFT sizes. Quartus II's DSP Builder blocks can map FIR, FFT, and channel-correction directly onto hardware multipliers with deterministic latency. The 1152-FCBGA package enables multi-gigabit LVDS links to RF front-end ADCs/DACs while maintaining signal integrity through dynamic on-chip termination.
Recomendado
High-Performance Computing Accelerator
The 107,500 logic elements of the EP3SE110F1152C4N support custom compute pipelines (FFT, encryption, compression, financial Monte Carlo) and the embedded multiplier array accelerates SIMD-style numeric workloads at FPGA clock rates up to 450 MHz. Designers commonly pair this device with a host CPU over PCIe Gen1/Gen2 hard IP blocks for co-processing offload. The 8.9 Mbit embedded memory serves as a high-bandwidth scratchpad, while the abundant I/O supports DDR2/DDR3 external memory interfaces. PowerPlay Early Power Estimator should be used pre-implementation to verify board thermal design for compute-dense workloads where fabric utilization exceeds 70%.
Recomendado
Broadcast Video Processing and Format Conversion
The EP3SE110F1152C4N is well suited to broadcast-grade video processing, where 107,500 logic elements and 896 multipliers can implement multi-channel SD/HD/3G-SDI processing, de-interlacing, scaling, and color-space conversion in a single device. Its modular I/O banks natively support SDI at 270 Mb/s to 2.97 Gb/s with on-chip termination, eliminating external resistor networks. Memory bandwidth from TriMatrix buffers handles line-store and frame-store requirements for broadcast switchers. Designers targeting 4K workflows can pair two EP3SE110 devices for left/right image partition or use one as a 4K up-conversion engine.
Recomendado
ASIC Prototyping and Emulation
For ASIC prototyping and in-circuit emulation, the EP3SE110F1152C4N's 107,500 logic elements partition reasonably for designs in the 1-2M ASIC-gate range, mapping ASIC cells to ALMs and using TriMatrix memory to emulate SRAM/ROM arrays. Designers can chain multiple devices via LVDS or SERDES side-band channels for higher-density ASIC emulations. Quartus II's incremental compile and LogicLock regions enable repeatable team-based verification cycles. The 1152-FCBGA package with 744 user I/Os provides ample pin capacity for full-speed ASIC I/O reproduction, including DDR3 and PCIe Gen2 interfaces.
Recomendado
Military and Aerospace Signal Processing
The EP3SE110F1152C4N serves as the processing engine in military/aerospace signal-intelligence and radar systems, where 107,500 logic elements and 896 multipliers implement pulse compression, Doppler filtering, and beamforming in a single device. Its commercial 0C to +85C grade fits ground-based and avionics-grade enclosures, while the EP3SE110F1152I4N industrial variant extends coverage for outdoor or near-engine installations. The FPGA's configuration bitstream can be encrypted with AES-256 to protect proprietary waveform IP in deployed assets. The 65 nm process is qualified per MIL-STD-883 screening flows by several aerospace integrators.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE110F1152C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE110F1152C3N | EP3SE110F1152C4LN | EP3SL110F1152C2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | -4 (C4) | -3 (C3) - faster | -4 (C4) - same | -2 (C2) - faster |
| Family Variant | Enhanced (E) - memory/multiplier rich | Enhanced (E) - same | Enhanced (E) - same | Logic-rich (L) - different DSP/memory mix |
| User I/O | 744 | 744 | 744 | 744 |
| Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (LN suffix) | Yes (N suffix) |
Diferenciadores clave
- Speed-grade C4 vs C3 (slower, lower cost) (frente a EP3SE110F1152C3N)
- Same-package footprint across speed grades (frente a EP3SL110F1152C2N)
- TriMatrix memory depth optimized for E variant (frente a EP3SL110F1152C2N)
Notas de diseño
The EP3SE110F1152C4N requires multiple supply rails: 1.1 V core (VCC), 2.5 V or 3.0 V auxiliary (VCCAUX), 3.0 V I/O bank supplies (VCCIO), and a PLL analog supply. Use a PowerPlay Early Power Estimator (EPE) spreadsheet pre-place-and-route to size the regulator budget; typical quiescent consumption is 3-5 W with active designs reaching 15-25 W at high fabric utilization. Decoupling must include 100 uF bulk per rail plus 10 uF and 100 nF ceramic networks near every BGA quadrant.
The 1152-FCBGA package has an exposed die top surface designed for heat-spreader attachment (not a heatsink solder pad). Use a thermal-interface material (TIM) with conductivity >= 3 W/m-K and a copper or aluminum spreader bonded with mechanical pressure. Estimated: at 20 W dissipation, theta_JA on a JEDEC JESD51 test board is roughly 8-12 C/W, giving a 160-240 C junction rise above ambient without active cooling; heatsink or forced airflow is mandatory.
The 1.0 mm pitch 1152-ball FCBGA requires a multilayer PCB stackup with microvia (laser-drilled) or stacked-via construction to fan out the inner-row balls. Maintain 50 ohm single-ended (90 ohm differential) controlled impedance on high-speed LVDS pairs; keep length matching within 150 ps for DDR3 and 50 ps for source-synchronous interfaces. Reference the Stratix III Device Handbook pin-out file for exact ball assignments and bank-power pin locations.
Do not mix 1.5 V and 1.8 V signaling on adjacent I/O banks without reviewing the VCCIO group restrictions. Confirm JTAG chain integrity with the Quartus II programmer before soldering; the FCBGA package is non-reworkable, so first-time-right build is critical. Always configure the device's MSEL pins to match the desired configuration mode (AS, PS, FPP, JTAG) at board power-up.
Información de cumplimiento
RoHS compliant per Intel product page; N suffix denotes lead-free. AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly stated. Conflict-minerals statement available from Intel.
