EP3SE110F780C2 vs EP3SE80F780C2 Comparación
Comparación detallada lado a lado de EP3SE110F780C2 por Intel y EP3SE80F780C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780C2 | EP3SE80F780C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.350,00 | $2.480,00 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Series | EP3SE110 | — |
| Logic Elements (LE) | 107,500 | — |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) | — |
| Maximum User I/O | 488 | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLLs | 4 | — |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Encapsulado | 780-BBGA, FCBGA (FineLine) | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Estado RoHS | Compliant | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |