EP3SE110F780C2 vs EP3SE80F780C2 Vergleich
Detaillierter Direktvergleich von EP3SE110F780C2 von Intel und EP3SE80F780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C2 | EP3SE80F780C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.350,00 | $2.480,00 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Series | EP3SE110 | — |
| Logic Elements (LE) | 107,500 | — |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) | — |
| Maximum User I/O | 488 | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLLs | 4 | — |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Gehäuse | 780-BBGA, FCBGA (FineLine) | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| RoHS-Status | Compliant | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |