EP3SE260F1152C4N vs EP3SE260F1152C2G Comparación
Comparación detallada lado a lado de EP3SE260F1152C4N por Intel y EP3SE260F1152C2G por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoleteComparación de especificaciones
| Parámetro | EP3SE260F1152C4N | EP3SE260F1152C2G |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.620,00 | $2.050,00 |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III (Enhanced) | Stratix III E |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| Encapsulado | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | -4 (commercial temperature) | C2 (commercial) |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'C' suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Tipo de memoria | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Operating Temperature Grade | — | Commercial (C) |
| Supply Packaging | — | Tray |
| Estado RoHS | — | Compliant (G suffix) |