EP3SE260F1152C4N vs EP3SE260F1152C2G 对比

详细并排对比 EP3SE260F1152C4N 出自 Intel 和 EP3SE260F1152C2G 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260F1152C4N EP3SE260F1152C2G
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $1,620.00 $2,050.00
Series Stratix III E EP3SE260
Family Stratix III (Enhanced) Stratix III E
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS —
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
封装 1152-ball FC-FBGA (flip-chip) 1152-BBGA, FCBGA (FineLine BGA)
Speed Grade -4 (commercial temperature) C2 (commercial)
工作温度 0C to +85C (commercial, 'C' suffix) —
安装类型 Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
存储器类型 SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Code — BGA (Ball Grid Array)
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray
RoHS 状态 — Compliant (G suffix)

数据手册与资源

浏览全部产品 创建 BOM 获取报价