EP3SE260H780C4N vs EP3SE260H780I4 Comparación
Comparación detallada lado a lado de EP3SE260H780C4N por Intel y EP3SE260H780I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260H780C4N | EP3SE260H780I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $1.390,00 |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Encapsulado | 780-ball FCBGA (Flip Chip BGA) | 780-ball FC-HFBGA (HBGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 hours) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (industrial, 'I' grade) |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Speed Grade | — | 4 |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance status] |