EP3SE260H780C4N vs EP3SE260H780I4N Comparación
Comparación detallada lado a lado de EP3SE260H780C4N por Intel y EP3SE260H780I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780C4N | EP3SE260H780I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $2.150,00 |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Encapsulado | 780-ball FCBGA (Flip Chip BGA) | 780-pin FC-HFBGA (FCBGA) |
| Tipo de montaje | Surface Mount | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 hours) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |