EP3SE50F484C4 vs EP3SE50F484C3N Comparación
Comparación detallada lado a lado de EP3SE50F484C4 por Intel y EP3SE50F484C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C4 | EP3SE50F484C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $832,10 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Embedded Memory | 5,760 Kbits | — |
| User I/Os | 296 | 296 |
| Logic Array Blocks (LABs) | 1900 | 1,900 |
| Encapsulado | FBGA-484 (FCBGA) | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Temperatura de funcionamiento | 0C to 85 C (commercial) | 0C to +85 C (commercial, C suffix) |
| Internal Frequency | [DATA_NEEDED: internal max frequency] | — |
| Transceivers | [DATA_NEEDED: transceiver count and rate] | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Tensión de alimentación | 0.9 V | Core and I/O voltages per Stratix III E datasheet |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Lead-free (per DigiKey listing) |
| Lead-Free | Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Device Logic Elements | — | 47,500 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Process Technology | — | TSMC 40 nm low-power CMOS |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Estado del ciclo de vida | — | Obsolete (per Worldway listing 2026-04-05) |