EP3SE50F484I3N vs EP3SE50F484C4LN Comparación
Comparación detallada lado a lado de EP3SE50F484I3N por Intel y EP3SE50F484C4LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484I3N | EP3SE50F484C4LN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $841,66 | $772,12 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Number of LABs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| Maximum User I/O | 296 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage VCC | 0.9 V | — |
| Auxiliary Voltage VCCAUX | 1.1 V | — |
| Process Technology | 65 nm | — |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial, bin 3) | C4 |
| Temperatura de funcionamiento | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Encapsulado | 484-pin FC-FBGA (flip-chip BGA) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: number of 18x18 multipliers] | — |
| Transceiver Count | [DATA_NEEDED: number of embedded transceivers] | — |
| Logic Elements (LE) | — | 47,500 |
| LABs/CLBs | — | 1900 |
| Total RAM Bits | — | 2,344,448 (2286 Kbit) |
| Number of I/O | — | 296 |
| Number of Multipliers (18x18) | — | 384 |
| Voltage - Supply (Core) | — | 0.85 V to 1.1 V |
| Voltage - Supply (I/O) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Encapsulado / Carcasa | — | 484-BBGA, FCBGA (FineLine BGA) |
| Lead Free / RoHS | — | Lead free / RoHS compliant |
| Process Node | — | 40 nm CMOS |
| Configuration | — | FPP / AS / JTAG |