EP3SE50F484I3N vs EP3SE50F484C4LN 对比

详细并排对比 EP3SE50F484I3N 出自 Intel 和 EP3SE50F484C4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE50F484I3N EP3SE50F484C4LN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $841.66 $772.12
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm —
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) C4
工作温度 -40C to +100C (industrial) 0C to +85C (commercial)
封装 484-pin FC-FBGA (flip-chip BGA) —
安装类型 Surface Mount (BGA) Surface Mount
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] —
Logic Elements (LE) — 47,500
LABs/CLBs — 1900
Total RAM Bits — 2,344,448 (2286 Kbit)
Number of I/O — 296
Number of Multipliers (18x18) — 384
Voltage - Supply (Core) — 0.85 V to 1.1 V
Voltage - Supply (I/O) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
封装 / 外壳 — 484-BBGA, FCBGA (FineLine BGA)
Lead Free / RoHS — Lead free / RoHS compliant
Process Node — 40 nm CMOS
Configuration — FPP / AS / JTAG

数据手册与资源

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