EP3SE80F1152C2 vs EP3SE260F1152C2 Comparación
Comparación detallada lado a lado de EP3SE80F1152C2 por Intel y EP3SE260F1152C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE80F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.325,00 | $2.400,00 |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Speed Grade | C2 | C2 (commercial) |
| Encapsulado | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |