EP3SE80F1152C2 vs EP3SE260F1152C2 对比
详细并排对比 EP3SE80F1152C2 出自 Intel 和 EP3SE260F1152C2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE80F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,325.00 | $2,400.00 |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 600 MHz | — |
| 工作温度 | 0 C to 85 C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Speed Grade | C2 | C2 (commercial) |
| 封装 | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Lead-Free | — | Yes |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |