EP3SE80F1152C2 vs EP3SE260F1152C2 Comparaison
Comparaison détaillée côte à côte de EP3SE80F1152C2 par Intel et EP3SE260F1152C2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE80F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 325,00 | $2 400,00 |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 600 MHz | — |
| Température de fonctionnement | 0 C to 85 C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Speed Grade | C2 | C2 (commercial) |
| Boîtier | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Lead-Free | — | Yes |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |