EP3SE80F780C2N vs EP3SE110F780C3N Comparación
Comparación detallada lado a lado de EP3SE80F780C2N por Intel y EP3SE110F780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE80F780C2N | EP3SE110F780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.180,00 | $1.245,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 4,300 |
| Embedded Memory | 6,843,392 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Encapsulado | 780-Ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Package Code | F780 | — |
| Speed Grade | C2 | — |
| Maximum Operating Frequency | 600 MHz | 500 MHz |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Core Voltage | — | 1.1 V |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |