EP3SE80F780C2N vs EP3SE110F780C3N 对比
详细并排对比 EP3SE80F780C2N 出自 Intel 和 EP3SE110F780C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE80F780C2N | EP3SE110F780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,180.00 | $1,245.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 4,300 |
| Embedded Memory | 6,843,392 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| 封装 | 780-Ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Package Code | F780 | — |
| Speed Grade | C2 | — |
| Maximum Operating Frequency | 600 MHz | 500 MHz |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Core Voltage | — | 1.1 V |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |