EP3SL50F780C3G vs EP3SL50F780C3 Comparación
Comparación detallada lado a lado de EP3SL50F780C3G por Intel y EP3SL50F780C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ ActivoIntel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SL50F780C3G | EP3SL50F780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $625,00 | $540,00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| Encapsulado | 780-ball FBGA | — |
| Tipo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | — |
| Configuration Method | SRAM-based, JTAG/AS configuration | SRAM-based, supports Partial Reconfiguration |
| Design Software | Intel Quartus II (v9.0+) | — |
| Estado RoHS | Compliant (per DigiKey listing) | Compliant |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| User I/Os | — | 488 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| Nivel de sensibilidad a la humedad (MSL) | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |