EP3SL50F780C3G vs EP3SL50F780C3 对比
详细并排对比 EP3SL50F780C3G 出自 Intel 和 EP3SL50F780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ 量产中Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ 最后一次采购规格对比
| 参数 | EP3SL50F780C3G | EP3SL50F780C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $625.00 | $540.00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | — |
| 工作温度 | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| 封装 | 780-ball FBGA | — |
| 安装类型 | SMD/SMT | — |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | — |
| Configuration Method | SRAM-based, JTAG/AS configuration | SRAM-based, supports Partial Reconfiguration |
| Design Software | Intel Quartus II (v9.0+) | — |
| RoHS 状态 | Compliant (per DigiKey listing) | Compliant |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| User I/Os | — | 488 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Speed Grade | — | 3 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| 湿敏等级（MSL） | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |