EP3SL70F484I3G vs EP3SL70F484I3 Comparación
Comparación detallada lado a lado de EP3SL70F484I3G por Altera y EP3SL70F484I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F484I3G | EP3SL70F484I3 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $305,00 | $1.013,66 |
| Series | Stratix III L | — |
| Family | Stratix III (low-power variant) | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| ALMs (Adaptive Logic Modules) | [DATA_NEEDED: ALM count] | — |
| Total Memory Bits | 2,699,264 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/O Pins | 296 | 296 |
| Transceivers | 24 | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| Maximum Transceiver Data Rate | [DATA_NEEDED: max transceiver Gbps] | — |
| Package Type | 484-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Package Pin Count | 484 | — |
| Speed Grade | I3 | -3 (mid-tier) |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Core Voltage | 1.0 V | — |
| Process Technology | 40 nm TSMC | — |
| Tipo de montaje | Surface Mount | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Interface | JTAG / Serial Passive / Active Serial | — |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Encapsulado | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |