EP3SL70F484I3G vs EP3SL70F484I3 Comparaison
Comparaison détaillée côte à côte de EP3SL70F484I3G par Altera et EP3SL70F484I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F484I3G | EP3SL70F484I3 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $305,00 | $1 013,66 |
| Series | Stratix III L | — |
| Family | Stratix III (low-power variant) | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| ALMs (Adaptive Logic Modules) | [DATA_NEEDED: ALM count] | — |
| Total Memory Bits | 2,699,264 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/O Pins | 296 | 296 |
| Transceivers | 24 | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| Maximum Transceiver Data Rate | [DATA_NEEDED: max transceiver Gbps] | — |
| Package Type | 484-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Package Pin Count | 484 | — |
| Speed Grade | I3 | -3 (mid-tier) |
| Plage de température de fonctionnement | -40C to +100C (Industrial) | — |
| Core Voltage | 1.0 V | — |
| Process Technology | 40 nm TSMC | — |
| Type de montage | Surface Mount | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | Compliant | Compliant |
| Configuration Interface | JTAG / Serial Passive / Active Serial | — |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Température de fonctionnement | — | -40C to +100C (industrial) |
| Boîtier | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |