EP4CE6F17C6 vs EP4CE6F17C8 Comparación
Comparación detallada lado a lado de EP4CE6F17C6 por Intel y EP4CE6F17C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6F17C6 | EP4CE6F17C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,10 | $19,85 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Configurable Logic Blocks (CLB) | 392 | — |
| Embedded Memory | 276,480 bits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | 2 |
| Maximum User I/O | 179 | — |
| Encapsulado | 256-FBGA 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm |
| Speed Grade | C6 (commercial) | C8 |
| Temperatura de unión de funcionamiento | 0°C to 85°C | — |
| Core Voltage VCCINT | 1.2 V (typical) | — |
| Process Node | 60 nm low-power | — |
| I/O Banks | 8 | — |
| Memory Blocks | M9K (30 blocks) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (FBGA) | — |
| Nivel MSL | 3 (168 hours) | — |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 6,272 |
| Logic Array Blocks (LABs) | — | 392 |
| Embedded Memory Bits | — | 276,480 |
| M9K Memory Blocks | — | 30 |
| Embedded 18 x 18 Multipliers | — | 15 |
| Global Clock Networks | — | 10 |
| Maximum User I/Os | — | 179 |
| Process Technology | — | 60 nm low-power SRAM |
| Core Supply Voltage | — | 1.0 V to 1.2 V |
| Temperatura de funcionamiento | — | 0 C to 85 C (commercial, C8 speed grade) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |